• 作者： Chang, Rong-Yeu; Chen, Chia-Hsun
• 中文摘要： 本論文研究以環氧樹脂做電子封裝反應成型程序充填與硬化階段之數值模擬,充填過程中樹脂假設為非彈性與非牛頓流體,並遵循Hele- Shaw流動之非恆溫系統,數值方法在平面方向採用有限元素法,厚度方向採用有限差分去,統御方程式包含質量、動量與能量方程式,樹脂材料本質方程式使用Castro與Macosko之黏度式,反應動力學採用Kamal等人之反應式,材料之密度、比熱與熱傳導係數均假設為常數,模具系統以單邊8模穴IC為例,預測流道上與模穴內節點之壓力、溫度、剪率與反應度變化,透視厚度層方向之溫度與反應度,並探討模溫、起始反應度、反應熱等加工條件對成型之影響。本論文之模擬結果可幫助吾人從事模具設計、成品設計、解決加工問題、選擇適當材料與估算生產週期。
• 英文摘要： Numerical simulation of both filling and curing processes in electronic encapsulation with epoxy molding compound (EMC) is developed in this work. The resin is assumed here to be inelastic and Non- Newtonian in a non- isothermal temperature field. The governing equations are solved by employing the hybrid finite-element and finite- difference method (FEM/FDM). The 8-cavity IC package mold is used as the geometrical model. The predicted results provide useful information regarding the process variables, i.e., the pressure, temperature, shear rate and conversion profiles. A ladder-type pressure increase and an abrupt shear-rate change are observed during the filling stage. The conversion and reaction rate of this EMC material are insignificant during the filling and early curing stages. Additionally, the effects of mold temperature and reaction heat are also discussed. Productivity can be markedly enhanced for processing under a higher mold temperature. The curing time of 60 sec can be cut significantly short to 38 sec if the mold temperature increases from 178 to 188.degree.C. The demold time is 5 seconds longer with a 200 KJ/kg decrease of reaction heat, probably due to the addition of fillers. This work demonstrates its powerful capabilities in optimal mold design, processing condition setting, suitable EMC selection and cycle time calculation.
• 中文關鍵字： 充填; 硬化; 電子封裝; 環氧樹脂; 數值模擬
• 英文關鍵字： Filling; Curing; Electronic Encapsulation; Epoxy Resin; Numerical Simulation