- 作者: Chi-Chao Wan
- 中文摘要: This paper reviews the technological development of direct copper plating and its reason. This paper also presents a classification of the existing processes based on its chemical nature, namely, a precious-metal activator, carbon colloidal solution and conductive polymer. The process with activator has a more complex reaction mechanism, which is also analyzed.
- 英文摘要: --
- 中文關鍵字: direct metallization, direct plating, direct copper plating
- 英文關鍵字: --