- 作者: 黃漢章; 王春山
- 作者服務機構: 中華醫事技術專科學校工業安全衛生科; 國立成功大學化學工程研究所
- 中文摘要: 選用含?及醚鍵結構的雙馬來醱醯亞胺單體(BMPN),與商業化常用之4,4-雙馬來醯亞胺一二苯甲烷單體(BMPM),及含?之環氧樹脂(DGEDN),藉由芳香二胺單體(DDM)進行加成硬化,使其得以延長交聯點間之分子量,降低交聯密度,和單獨BMI硬化樹脂比較,確可降低彈性模數,改進硬化樹脂之脆性。硬化樹脂中?環的存在,和商業化之樹脂BMPM相比,有著較高的玻璃轉移溫度、熱安定性、彈性模數以及較低的吸水性,比較含?之環氧樹脂亦可得相同之結果。將此含?雙馬來醯亞胺,配合雙胺單體(DDM),以等比例進行線性加成聚合反應(Michael addition),可得新穎之不定形的Polyaspartimide,此聚合物可溶於DMF、DMAc·DMSO NMP等溶劑中。
- 英文摘要: The curing characteristics of bismaleimides (2,7-bis(4-maleimidophenoxy)naphthalene; BMPN and4,4-bismaleimidophenylmethane:BMPM) were investigated using diamine (4,4-diaminodiphenylmethane;DDM) as a chain extender at a 2/1 molar ratio of bismaleimide/DDM through a Michael-type addition.In addition, linear polyaspartimide was prepared by polyaddition of BMPN and DDM at a 1∕1 molar ratioin m-cresol.The polymer was amorphous and soluble in various organic solvents.such as N-methyl-pyrrolidone (N-NMP),N,N-dimethylacetamide (DMAc),N,N-dimethylformamide (DMF) and dimethylsulfoxide (DMSO).The thermal behavior and properties of the cured products were investigated by meansof thermogravimetric analyses and dynamic mechanical analyses.At this molar ratio,the properties ofBMPN/DDM showed better Tg, thermal decomposition temperature and moisture resistance than did theepoxy derived from 2,7-dihydroxynaphthalene cured using the DDM system (diglycidyl ether of 2,7-dihydroxynaphthalene (DGEDN)/DDM).
- 中文關鍵字: naphthalene; bismaleimide; Michael addition
- 英文關鍵字: --