• 作者： 陳穎煌
• 作者服務機構： 私立淡江大學化工系
• 中文摘要： 影響COB (Chip On Board)的品質及可靠度的因素有二：一為電路板上的黏著性大小，另一是因被覆／包裝所引起的應力大小，本研究利用一含有test pads及diffusion resistors的測試晶片來測量黏著性及應力大小，從拉力實驗結果顯示平滑暗黃色的軟金表面有最佳的黏著性，應力實驗用來測試不同的被覆材料所引起的應力，它同時顯示在較高溫的硬化條件下，對矽晶片所造成的殘留應力較大。 此測試晶片的優點在於可直接測量到黏著性及應力的大小，從而選擇最適切的COB流程。
• 英文摘要： The two major factors determining the quality/reliability of the chip on board (COB) technology arethe bondability of the printed circuit board and the magnitude of the stress induced by the encapsulation/assembly processes. In the present study, a test chip made of test pads and diffusion resistors is used toquantify the bondability and induced stress. From bond pull analysis, it was found that a smooth denseyellow soft gold surface yields the highest bonding force. The stress test was used to characterize differentsealing materials at various curing temperatures. Higher curing temperatures were found to induce a higherresidual stress on the silicon chip. This test chip methodology permits nondestructive direct measurementof the bonding condition and residual stresses which can be used to optimize the COB process.
• 中文關鍵字： bondability; test chip; COB
• 英文關鍵字： --