• 作者： Chen, C. S.; Wan, C. C.; Wang, Y. Y.
• 中文摘要： 本文主要研究於旋轉電極下，錫、鉛和錫鉛合金在甲基磺酸鍍液下的電化學加成行為，並且也對外加於電極的電位與鍍液中金屬離子含量對鍍層組成的影響加以探討。由錫、鉛和錫鉛合金在MSA系統下的電化學行為得知，錫和鉛的還原反應為各自獨立彼此間無交互影響。鍍層沉積的組成深受外加於電極的電位與鍍液中金屬離子含量的影響。當鍍液中鉛離子的含量超過25mol.%時，則鍍層中主要以析鍍鉛為主。當鍍液中鉛離子的含量低於25mol.%時，則鍍層中主要以析鍍鍚為優先，甚至在低電位時其鍍層含鉛量逾50mol.%。當鍍液中鉛離子的含量大約為25mol.%時，則鍍層中析鍍出的組成與鍍液中的組成相同。除此之外，鍍層中析鍍出的組成均維持定值而不受外加於電極的電位的影響。
• 英文摘要： This study examined the electrochemical behavior of electrodeposition of tin, lead, and tin-lead alloys on a rotating disk electrode in methane sulfonate acid solution (MSA). Also investigated herein was how cathodic potential, rotating concentration influence the composition of deposits. When the lead content in a both was controlled at 0.0075M and exceeded 25mol.% of the total metal ion content, lead deposited preferentially. In a bath below 25mol.% lead, the deposit's major component was tin. At approximately 25mol.% lead, the deposit had the same ratio of tin and lead as in the solution. In this case, the deposit's composition became independent of the applied potential.
• 中文關鍵字： 錫; 鉛; 陰極極化; 旋轉電極; 甲基磺酸
• 英文關鍵字： Tin; Lead; Cathodic Polarization; Rotating Disk Electrode; Methane Sulfonic Acid