• 作者： Lin, Wen-Hsung; Chang, Hsin-Fu
• 中文摘要： 無電鍍銅觸媒在製備中，以鈀為析鍍中心，本研究以γ-Al/sub 2/O/sub 3/為載體，先行含浸氯化鈀溶液，得到四種鈀含量(0.08-0.33wt%)之先驅物，再以 1200c.c及800c.c.之無電鍍銅鍍液析鍍，製備八種銅含量(5.45~27.27wt %)之觸媒。以定量體積化學吸附方法，分析銅及鈀之分布情形，用CO及H/sub 2/量測鈀之分散性，並以N/sub 2/O及NH/sub 3/分別做銅表面積及觸媒酸度測試，以乙醇進行脫氫反應，得以了解銅觸媒之特性及反應活性。實驗結果得知在特定鍍液中，銅析鍍量隨鈀含量線性上升，顯示分散鈀與無電鍍銅有密切的關係，無電鍍銅之銅表面積在銅含量13.67-15.8wt%時呈現極大值，乙醇脫氫之轉化率隨銅含量增加而稍微變化。無電鍍銅觸媒對乙醇脫氫可能為結構敏感型反應。
• 英文摘要： In the preparation of electroless copper catalysts, palladium serves as the nucleating center to trigger the chemical deposition. In this study PdCl/sub 2/ was impregnated on .grmma.-Al/sub 2/O/sub 3/ to get four precursors which possessed various palladium loadings(0.08-0.33wt%). Subsequently, two electroless copper plating bath volumes (800cc and 1200cc) were applied to get eight catalysts with different copper loadings (5.45-27.27wt%). The distributions of copper and palladium were analyzed by the volumetric chemisorption method. CO and H/sub 2/ were used to measure the dispersion of palladium. N/sub 2/O and NH/sub 3/ were used to measure the copper surface area and the acidity of catalysts, respectively. Ethanol dehydrogenation was adopted as a model reaction to characterize the activity of electroless copper catalysts. The experimental results showed that copper loadings increased linearly with palladium loadings in a specific plating bath volume, which was indicative of an intimate relationship between the dispersed palladium and the electrolessly-plated copper. The maximums of copper surface areas were observed when copper loadings appeared in the range of 13.67wt% to 15.8wt%. The conversions of ethanol slightly depended upon copper loadings. Ethanol dehydrogenation over electroless plated copper catalysts might be a structure-sensitive reaction.
• 中文關鍵字： 銅催化劑; 氧化鋁; 無電鍍; 乙醇; 脫氫; 鈀
• 英文關鍵字： Copper Catalyst; Alumina; Electroless Plating; Ethanol; Dehydrogenation; Palladium (Pd)