• 作者： Shiau, Ching-Yeh; Tsai, J.C.
• 中文摘要： 本研究是利用無電鍍法製備銅觸媒,並與含浸法製備的銅觸媒做一比較。銅含量從5%到 10%,氧化鋁為擔體。實驗結果顯示無電鍍銅觸媒的結晶顆粒比含浸法的小、分散性佳,且有較大的比表面積。不過兩種製備方法均會造成擔體中小孔洞的堵塞,以致減損擔體部分的表面積,而含浸法所造成的堵塞更嚴重。在正丁醇脫氫反應方面,無電鍍銅觸媒的活性及穩定性也較佳。
• 英文摘要： Copper catalysts prepared by electroless deposition method were investigated and compared with those by impregnation method. Copper contents varied from 5% to 15%, and .gamma.-Al/sub 2/O/sub 3/ was used as support. All catalysts were characterized by BET, SEM, TPR and DSC and tested by n-butanol dehydrogenation reaction to see their activities and stabilities. It was found by the SEM analyses that as comparing to the impregnated method, the catalysts prepared by the electroless method had smaller copper crystals and better dispersion. The BET results also showed that the electroless copper catalysts had larger specific surface area. However, the catalysts prepared by the two methods presented larger average pore size and less surface area than those of the fresh .gamma.-Al/sub 2/O/sub 3/ indicating that smaller pores might get blocked during the preparation course. This blockage was more severe in the impregnation method. For the butanol dehydrogenation reaction, the electroless copper catalysts gave better reaction performances.
• 中文關鍵字： 無電鍍; 銅; 觸媒; 正丁醇; 脫氫; 含浸法
• 英文關鍵字： Electroless Plating; Copper; Catalyst; Butanol; Dehydrogenation; Impregnation