• 作者： Wang, C.T.; Chiang, Y.Y.; Wang, Y.Y.et al.
• 中文摘要： 本研究係對薄層線路(SLC)進行直接電鍍法中程序之改進。所研究之底材對象為Probimer-52,由實驗發現鍍層之品質受觸媒濃度和硫化鈉促進劑濃度之綜合影響。最佳之硫化鈉濃度為 0.5g/l,加以浸漬1.5分鐘,其電鍍速率可達1. 76mm/min。
• 英文摘要： The feasibility of applying direct plating to surface laminar circuit (SLC) system via Pd/Sn catalyst and Na/sub 2/S promotion has been explored. The substrate to be tested was Probimer-52. It was found the platability is strongly influenced by a combination of the concentration of Pd catalyst and sodium sulfide. An optimal concentration of Na/sub 2/S was found to be 0.5g/l with an immersion time of 1.5 minutes. The plating rate was found to reach 1.76mm/min.
• 中文關鍵字： 直接電鍍; 薄層線路; 最適化; 觸媒; 活化
• 英文關鍵字： Direct Planting; Laminar Circuit; Optimization; Catalyst; Activation