第8卷‧第9期,
198009
, pp. 782-797
脈狀電流對厚金電鍍程序之影響
- 作者:
萬其超; 唐正雄; 吳璧月
- 作者服務機構:
國立清華大學化工研究所
- 中文摘要:
本研究分成兩部分:第一部分是脈狀電流(Pulse Current)對鍍金動力方面的影響,包括電流效率(Current efficiency)及極限電流密度(Limiting current density);第二部分是脈狀電流對金鍍層性質的影響,包括微硬度(Micro hardness)、孔隙度(Porosity)及接觸電阻(Contactresistance)。 實驗結果顯示以平均電流密度(Mean current density)為準,脈狀電流鍍金的電流效率較直流(Direct current)鍍金為低。脈狀電流鍍金可以提高瞬時極限電流密度(Instantaneouslimiting current density),因此延長了可利用電流密度範圍。通電流和停電流時間的比值(on-off time ratio)愈小,瞬時極限電流密度提高的程度愈大。 關於鍍層性質的影響,惟有在鍍層厚度小於2.7 μm時,脈狀電流鍍金才能比直流鍍金得到較低的孔隙度。脈狀電流鍍金所獲得鍍層的微硬度較直流鍍金高,接觸電阻則較直流鍍金低。而通電流和停電流時間的比值對鍍層的性質有很大的影響。
- 英文摘要:
This program consists of two parts. Thefirst part deals with the influence of pulse currenton the kinetic aspects of gold plating, includingits current efficiency and limiting current density.The second part deals the effect of pulse currenton the properties of gold deposit, includingmicrohardness, porosity and contact resistance. It was found that with pulse current, thecurrent efficiency is lower but the limitingcurrent density is higher. When the thickness of deposit is below2.7 μm, the deposit is less porous and harderby pulse plating. The contact resistance is alsoreduced by pulse plating.
- 中文關鍵字:
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- 英文關鍵字:
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