• 作者： Lee, Yu-Der
• 作者服務機構： Polymer Research Institute, National Tsing Hua, University, Hsinchu, Taiwan, R. O. C.
• 中文摘要： --
• 英文摘要： Dynamic properties of H-film (4,4'-oxydiphenylenepyromellitimide), PIA
  (a polyimide copolymer, 3 parts BTDA+1 part PMDA+4 parts 4,4'-DABP) and
  PIB (a polyimide copolymer, 1 part BTDA+1 part 3,3'-DABP were investigated.
  H-film had four transition regions at temperatures from -120℃ to +500℃, which
  agreed well with literature reports. Both PIA and PIB has three transition zones.
  The α transition (Tg) for PIA was 325℃ and that for PIB was between 275℃ to
  281℃ depending on the solvent system. The β transition (from 140℃ to 210℃)
  was probably the result of local chain movements and the 7 transition (from -90℃
  to -50℃) might be the vibration or rotation of side groups around the polymer
  chain. The adhesive abilities of PIA and PIB were determined by a new variable,
  the adhesive factor, tan δadh. As the data indicated, diglyme was the best solvent
  for adhesion purpose and PIA was a better adhesive at the high temperature and
  a worse adhesive at the low temperature than PIB. Either PIA or PIB was
  thermally stable at temperatures up to 300℃ (5), therefore they Lad great potential
  as high temperature resistant adhesives.
• 中文關鍵字： --
• 英文關鍵字： --