- 作者: 洪子聖
- 作者服務機構: 國立中山大學電機工程學系
- 中文摘要: 本論文在擴展全波頻域分析法去嚴格地計算由微帶不連續與集總元件如電阻、電容、電感等構成的混合微波積體電路之電性特徵。結構採用具矩形截面的金屬線連接集總元件並且附在微帶平面上。此時,包含集總元件的微帶電場積分方程式可被推導。在利用動差法的數值技巧中,微帶表面電流密度乃由屋頂式區域函數展開,而金屬線內的體電流密度則由均勻矩形管狀函數展開。當某一段金屬線連接一集總元件時,須設定兩端所構成的電壓降等於金屬線內電流乘於集總元件之阻抗。本論文的特色即在動差數值方法中巧妙地考慮上述情況,使得微帶電流密度分佈之數值解可以完全反映集總元件的存在。最後針對常見的混合微波積電路如威更生功率分配器與藍基耦合器做全波模擬與實驗驗證。理論與實驗數值彼此符合良好。
- 英文摘要: This paper extends the full-wave spectral-domain approach (SDA) to rigorously analyze hybridmicrowave integrated circuits (HMICs) formed with microstrip discontinuities and linear two-terminallumped elements such as resistors, capacitors, and inductors. Metallic wires of rectangular cross sectionare used to connect these lumped elements and attach them to the planar microstrips. Under this scheme,electric field integral equations which include linear lumped elements are derived. In the method ofmoments, the surface current density on the microstrip is expanded in terms of a number of roof-topsubdomain functions whereas the volume current density through the metallic wire is expanded using severalsegments of uniform rectangular pipes. One of the segments in a metallic wire connects to a lumpedelement. The voltage across the segment is regarded as being equivalent to the current through the segmentmultiplied by the impedance of the element. The analysis skillfully puts this characteristic into the methodof moments such that the solution of the microstrip currents can account for the existence of a lumpedelement. Several commonly used HMICs, including Wilkinson power splitters and Lange couplers, aresimulated and measured. Excellent agreement between theory and measurement has been observed.
- 中文關鍵字: full-wave spectral-domain analysis; hybrid microwave integrated circuits
- 英文關鍵字: --