• 作者： 羅吉宗
• 作者服務機構： 私立大同工學院
• 中文摘要： 電蝕過程的每一步驟對最後電蝕鋁箔品質之影響都不可忽視，尤其以高純鋁素箔之不純物控制、冷加工時之應力均勻分布及電化學點蝕時之重要因素之把握更須謹慎。 鋁箔在含氯溶液中進行電化學點蝕是在鋁之氧化膜上起生蝕孔，本文以三種方法做電化學點蝕（中性直流法、酸性交流法、交流加直流法），其中交流法開發了陽極表面處理法及溶液加氧化劑法。三種蝕法之重要控制因素都為氯離子濃度、溶液之溫度及鋁箔單位面積所接受之總電量等。 電蝕箔單位面積之電容量和其抗拉、抗彎強度都與電蝕箔之表面結構頗有關聯，金相分析顯示，電容值較高且機械性質較佳者，其蝕孔較細且分布較均勻。
• 英文摘要： The factor affecting the etched foil mor-phology is complex. Each step of the etchingprocess can change the quality of the etchedfoil. Especially, the impurities distribution ofthe high-purity aluminium foil, the stress dis-tribution of the cold worked foil, and the elec-trochemical pitting procedure should be carefullycontrolled. Three processes of the etching techniquehave been developed (DC process, AC process,AC+DC process). Two kinds of AC processhave been compared. All the processes of theelectrochemical etching should carefully controlthe concentration of the chloride ion, the totalcharge per area, the current density and thesolution temperature. The capacitance and the strength of theetched foil strongly depend upon the surfacemorphology. Microstructures show that themore etching pits have, the finer pitting sizehas, and the etching pits distribution is moreuniformly. Therefore, the higher capacitanceand better mechanical properties are obtained.
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